A.Superiorchipdensity
B.Balanceperformance,cost,andpowerandcoolingefficiency
C.Flexibleconfigurationsreadyforintegrationandtestingatthecustomerlocation
D.Standardrackmounting
参考答案:B
A.Superiorchipdensity
B.Balanceperformance,cost,andpowerandcoolingefficiency
C.Flexibleconfigurationsreadyforintegrationandtestingatthecustomerlocation
D.Standardrackmounting
参考答案:B